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The new iPad Pro improves heat dissipation by 20% with an innovative use of a copper Apple logo.

Mon, May 13 2024 08:15 PM EST

Pulsestacks reported on May 11th that Apple's latest iPad Pro released this year comes with several highlights, such as an upgraded M4 chip, advanced dual-layer series OLED technology, and more. One standout feature is the 20% improvement in heat dissipation, with a significant contributor being the Apple logo on the back. ?url=http%3A%2F%2Fdingyue.ws.126.net%2F2024%2F0511%2Fb538faf7j00sdbqfu0010d000r800fbg.jpg&thumbnail=660x2147483647&quality=80&type=jpg Apple has stated that the new iPad Pro offers higher performance and improved heat dissipation compared to its predecessor. Two key enhancements in terms of cooling include the addition of graphite sheets to the casing and the utilization of the Apple logo on the back as an additional heat dissipation element. ?url=http%3A%2F%2Fdingyue.ws.126.net%2F2024%2F0511%2F91f4f447j00sdbqfu0019d0018g00ozg.jpg&thumbnail=660x2147483647&quality=80&type=jpg The Apple logo is made of copper and can serve as a heat sink to help cool the M4 chip and internal components. While Apple has not officially disclosed the cooling contribution of the new copper Apple logo, it is seen as an innovative use. Media outlet SamMobile, known for covering Samsung news, couldn't help but exclaim, "Apple's logo is more practical than Samsung's." ?url=http%3A%2F%2Fdingyue.ws.126.net%2F2024%2F0511%2F88302764p00sdbqfu000bd000hy003vg.png&thumbnail=660x2147483647&quality=80&type=jpg