Recently, a team led by Researcher Zhongshuai Wu from the Dalian Institute of Chemical Physics, Chinese Academy of Sciences, in collaboration with Researcher Yao Lu, Professor Xinliang Feng from Dresden University of Technology, Germany, and the Max Planck Institute for Microstructure Physics, achieved new progress in the field of highly integrated micro-supercapacitor modules. They developed a novel strategy for patterned adhesion-based electrolyte-directed deposition, enabling efficient, rapid, and precise electrolyte addition on large-area, highly integrated, and ultra-miniaturized microelectrode arrays. This led to the development of small, highly integrated, and high-performance micro-supercapacitor energy storage modules with consistency. Their findings have been published in Nature Communications.
To meet the rapid development of small-scale, wearable, and implantable microelectronic devices, there is a need to develop micro-energy storage devices with small volume, high integration, high performance, and high compatibility. Planar micro-supercapacitors, due to their special structure without the need for membranes and external metal interconnects, along with reliable electrochemical performance and easily controllable connection methods, have significant potential for development in the field of microelectronics. However, challenges remain in large-scale production of highly integrated, high-performance, and customizable micro-supercapacitor energy storage modules due to the lack of reliable high-precision microelectrode array fabrication and efficient electrolyte deposition techniques.
The research team developed a universal and controllable strategy for electrolyte positioning self-assembly, achieving precise and rapid positioning and addition of electrolyte microdroplets on high-density large-scale microelectrode arrays. Combined with high-precision photolithography and automatic spray coating techniques, they developed integrated micro-supercapacitor modules with high area density, high output voltage, and stable performance. Initially, the team utilized high-precision photolithography and highly stable automatic spray coating techniques to fabricate ultra-miniaturized integrated micro-supercapacitor electrode arrays. Subsequently, by employing photolithography and surface modification techniques, they designed patterned adhesion on the surface of the integrated module, achieving precise, rapid, and uniform addition of electrolyte within extremely small areas. This confined the electrolyte within 5 seconds for 10,000 microdevice unit electrolytes on the integrated module while ensuring good electrochemical isolation between adjacent unit microdevices. Moreover, the micro-supercapacitor module maintained nearly 100% of its initial capacity after 9,000 cycles at an extreme operating voltage of 190V.
Utilizing the flexible and diverse connection methods of planar micro-supercapacitors, the team also developed a seamlessly integrated ultra-compact microsystem consisting of a wireless charging coil and micro-supercapacitor module. Wireless charging ceased after only 2 seconds, and the microsystem effectively powered a display screen for 30 minutes, demonstrating significant potential for practical applications.
