Google's Pixel 9 and Pixel 9 Pro are not only expected to undergo significant design changes, but also reportedly to receive two meaningful upgrades. According to the latest reports, one is a new 5G modem, and the other is satellite connectivity, a feature introduced by Apple with the iPhone 14 series in 2022.
Since switching to semi-custom Tensor chipsets in 2021, Google's Pixel lineup has faced several modem-related issues. Fortunately, these may be a thing of the past as reported by Android Authority, with the Pixel 9 and Pixel 9 Pro set to feature Samsung's Exynos 5400 5G modem. While specific specs haven't been provided, this baseband chip is expected to offer faster performance and lower power consumption compared to the Exynos 5300 in the previous generation Pixel models.
Reportedly, its software stack has been upgraded, promising improved stability. Most notably, the Exynos 5400 will support 3GPP Release 17, enabling the use of Non-Terrestrial Networks (NTN) for 5G, essentially satellite-based communication. Google is said to be working towards implementing a "satellite SOS" feature for Pixel phones, with all these advancements attributed to the company's collaboration with T-Mobile, which, in turn, partnered with SpaceX to introduce the infrastructure.
The Pixel 9 and Pixel 9 Pro will support satellite connectivity, primarily for text-based communication rather than calls. However, a special "satellite gateway" app will facilitate communication with emergency services through a feature called "Emergency SOS." It's believed that this new feature will be triggered when users of the Pixel 9 or Pixel 9 Pro find themselves trapped or in life-threatening situations. Let's hope Google, known for shuttering services, doesn't abandon this project, as it could greatly save lives.
Another upgrade not mentioned in the report is that the Pixel 9 and Pixel 9 Pro will feature Google's Tensor G4 chip. Previously rumored to be a minor upgrade over Tensor G3, we now understand that the new chip will utilize FOWLP or "Fan-Out Wafer-Level Packaging" technology, similar to what Samsung's Exynos 2400 employs. Apart from enhancing performance, this packaging aids in heat resistance, allowing Tensor G4 to maintain higher levels of multi-core performance. Given past reports of overheating with Tensor G3, this will be seen as a welcome change for Tensor G4.
