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On April 7th, Hidefumi Miyajima, Chief Technology Officer of Armor Heroes, revealed that the company plans to mass-produce 3D NAND flash memory with over 1000 layers by 2031.

Shang Fang Wen Q Tue, Apr 09 2024 09:06 AM EST

Armor Heroes' latest flash memory technology, the 8th generation BiCS, which was introduced in March 2023, currently stacks 218 layers with an interface speed of 3200MT/s.

As for what new technologies and processes will be used to achieve over 1000 layers, Armor Heroes did not specify.

Currently, SK Hynix holds the record for the highest number of stacked layers in flash memory technology, reaching 321 layers, but mass production is not expected until the first half of 2025.

Interestingly, Samsung previously stated plans to achieve 1000 layers of flash memory (with SSD capacity planned up to 1000TB) by 2030. It remains to be seen who will be the first to achieve this milestone, Samsung or Armor Heroes.

Samsung's V-NAND technology has advanced to the ninth generation and is set to begin production early next year. Based on a double-stack architecture, it is expected to achieve the highest stacking layers in the industry, surpassing 300 layers. The subsequent tenth generation is projected to reach around 430 layers. s_bc1501e55d2543a783621fddd6e38140.jpg