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On April 17th, it was announced that the U.S. Department of Commerce approved up to $6.4 billion in subsidies for Samsung Electronics under the Chip Act, with the condition that it builds a new wafer plant in Tyler, Texas.

Shang Fang Wen Q Thu, Apr 18 2024 09:01 AM EST

Samsung has been manufacturing chips in Austin, Texas since as early as 1996, with previous investments totaling $18 billion. The company's next venture into Tyler involves an initial investment of at least $17 billion, marking the largest foreign investment in the area.

According to U.S. officials, Samsung's total investment in the new plant is expected to exceed $40 billion and create at least 21,500 job opportunities locally.

Details regarding the manufacturing process and types of chips to be produced at the new facility have not been disclosed by either the U.S. government or Samsung. s_734ced881f21435daaa8c8b7f07c33eb.jpg Prior to this, Intel received $8.5 billion in direct subsidies and $11 billion in low-interest loans, while TSMC obtained $6.6 billion in cash subsidies and $5 billion in low-interest loans. Additionally, GlobalFoundries received $1.5 billion in direct subsidies, Microchip received $162 million in direct subsidies, and BAE received $35 million in direct subsidies.

Following these subsidies, TSMC plans to build its third semiconductor fab in Phoenix, Arizona, with total investments in the US exceeding $65 billion, introducing 2nm and even more advanced processes.

It's worth noting that Ursula Burns, co-chair of the Advisory Committee on Semiconductor Competitiveness (ACSCC), will join TSMC's board. She previously served as head of the White House STEM program and chair of the US Export Council, which has influenced US export policies to some extent. s_ae293b4d924e4302801710f8339f4bed.png