TechDaily News – Reporter: Yan Xue
During the NVIDIA annual developer conference "GTC 2024" held in San Jose, USA from March 18th to 21st, South Korean semiconductor companies comprehensively showcased their fifth-generation HBM (High-Bandwidth Memory) products, aiming to fiercely compete in the artificial intelligence (AI) semiconductor memory market.
NVIDIA unveiled the new generation AI semiconductor product "Blackwell" at "GTC 2024," significantly improving its performance compared to existing products, further solidifying its leading position in the AI semiconductor field. SK Hynix currently holds an advantageous position in the HBM product competition as it exclusively supplies HBM3 products to NVIDIA. At the opening of "GTC 2024," SK Hynix announced the official mass production of HBM3E (i.e., the fifth generation HBM) related products and began supplying them to NVIDIA first, aiming to gain an early advantage.
During the conference, NVIDIA CEO Jensen Huang visited the Samsung Electronics booth, where he left his signature on their exhibited HBM3E products, stating, "We are currently testing Samsung Electronics' HBM products and have high expectations." Samsung Electronics' stock price surged shortly thereafter. In December 2023, Samsung Electronics established a memory product planning department, focusing on analyzing technology trends and marketizing products, including HBM products, and providing technical support, laying out long-term plans to expand into the AI semiconductor memory market.
Closely following behind South Korea's major semiconductor companies is the US memory company Micron. Micron announced its performance from December 2023 to February 2024 on March 20th, revealing that its products have officially entered NVIDIA's supply chain. Their 24GB 8H HBM3E product will be supplied to NVIDIA and used in NVIDIA's H200 Tensor Core GPU.
