Reports on April 2nd indicate that Apple is actively discussing with multiple suppliers to apply glass substrate technology in chip development.
It's understood that glass substrates possess high-temperature resistance, enabling chips to maintain peak performance for longer durations.
Moreover, the ultra-flat nature of glass substrates allows for more precise etching, thereby enabling components to be packed more tightly together, enhancing circuit density per unit area.
The application of glass substrates represents not only a material innovation but also a global technological competition. It holds the potential for revolutionary breakthroughs in chip technology and could become one of the key directions in future chip development.
Apple's active involvement is likely to expedite the maturity of glass substrate technology and bring about new breakthroughs in chip performance.
Previously, Huajin Securities stated that future computational power will lead the next digital revolution, with continuous growth in demand for high-performance chips like GPUs. Glass substrates, as the next-generation advanced packaging, have vast market potential.
