On May 10th, it was reported that for Chinese semiconductor manufacturers, producing chips at 7nm and below will remain challenging for the foreseeable future.
A report by the Semiconductor Industry Association (SIA) and Boston Consulting Group (BCG) indicates that by 2032, China is projected to produce 28% of chips below 10nm, but only 2% are expected to be at advanced nodes.
Similar to China, the United States currently lacks the capability to produce chips below 10nm. However, this is not a significant issue for them as companies like TSMC and Samsung have already begun building fabs domestically.
It is estimated that over the next decade, the chip production capacity in the U.S. will grow by 203%. By 2032, the U.S. is expected to account for 14% of the global chip production capacity.
President and CEO of SIA, John Neuffer, stated, "China appears to be putting more effort into so-called traditional chips."
The report also indicates that by 2032, China's production capacity share for chips ranging from 10 to 22nm will double, increasing from 6% to 19%.
For chips of 28nm and above, China is expected to see the largest increase in market share, rising from 33% in 2022 to 37% by 2032.
The report predicts that China will only be able to produce 2% of the world's most advanced chips (7nm and below).
Hope that excellent domestic manufacturers like Huawei can work together...
