Armored Knight has announced the sampling of its latest generation UFS 4.0 flash memory chips, offering capacities of 256GB, 512GB, and 1TB.
The new flash memory chips are said to boost the utilization of 5G networks, thereby accelerating device download speeds, while significantly reducing latency, resulting in a noticeably enhanced user experience.
Meanwhile, smaller packaging sizes contribute to saving PCB space, improving PCB utilization, and enabling more flexible and relaxed circuit designs.
The new flash memory chip adopts Armor Man's BiCS Flash 3D memory and controller chip, integrating MIPI M-PHY 5.0 and UniPro 2.0, supporting theoretical interface speeds of 23.2 Gbps per channel or 46.4 Gbps per device, and backward compatible with UFS 3.1.
Compared to the previous generation UFS 4.0 products, the sequential write speed of the new flash memory chip has increased by 15%, the random write speed has increased by 50%, and the random read speed has increased by 30%, while the sequential read speed remains unchanged, still at 4640MB/s.
Additionally, the new product adopts JEDEC standard 9mm x 13mm packaging, which is 18% smaller than the previous 11mm x 13mm packaging. The thickness of the flash packaging for 256GB and 512GB is 0.8mm, while for 1TB, it is 0.9mm.
Armor Man officials also stated that samples of the 256GB and 512GB capacity products began shipping this month, while the 1TB product will not ship until after June. Sample specifications may differ from the final production version.
