On May 21st, it was reported that Apple's COO, Jeff Williams, visited TSMC for a secret meeting, where Apple secured early access to TSMC's 2nm process capacity.
TSMC is introducing GAAFET technology for the first time in the 2nm process. Unlike the FinFET architecture used in 3nm and 5nm processes, the GAAFET architecture is based on Gate-All-Around (GAA) technology, addressing issues like current leakage due to process scaling seen in FinFET.
Compared to FinFET transistor technology, GAAFET transistors have a more complex structure, lower threshold voltage, leading to enhanced performance, lower power consumption, and improved power efficiency.
TSMC is investing billions in upgrading its production lines, while Apple will need to adapt its chip designs to accommodate the new technology.
Apple, a key client of TSMC, typically is the first to access TSMC's latest chip processes. For instance, Apple secured all 3nm chip production capacity for iPhone, iPad, and Mac devices from TSMC in 2023.
Therefore, Apple will be the first to utilize TSMC's 2nm process, with mass production expected as early as 2025.
