On March 29th, reports surfaced unveiling the Apple M3 Ultra, a chip redesigned from the ground up rather than being a fusion of two M3 Max chips.
It's well known that the previous generation chip, the M2 Ultra, utilized the UltraFusion architecture, merging two M2 Max chips together, boasting 134 billion transistors, 200 billion more than the previous M1 Ultra.
UltraFusion, a customized packaging technology by Apple, connects chips with over 10,000 signals using a silicon interposer, resulting in a significant leap in performance.
Latest reports indicate that the Apple M3 Ultra is not intended to fuse two M3 Max chips but is instead redesigned, making it the most powerful chip in Apple's M-series history.
Additionally, noteworthy is that the Apple M3 Ultra is fabricated using TSMC's N3E process, marking Apple's first chip on the N3E node. Subsequent entries like the A18 series will also adopt the N3E node, while chips like the M3 and A17 Pro will continue to use TSMC's N3B process.
This chip will debut with the Mac Studio, with the new product expected to hit the market as early as mid-year.
