On May 20th, recent leaks have shared information about the AMD Zen6 and Zen5C architectures.
The information indicates that the AMD Zen 6 architecture will offer three configuration options: 8 cores per CCD, 16 cores, and up to a maximum of 32 cores, a significant increase compared to the current Zen 4 architecture.
This means that in dual-CCD components like Ryzen CPUs, the core count can reach up to 32 cores, or with the same CCD layout, a maximum of 64 cores.
Zen 4 deploys up to 12 CCDs on top-tier EPYC chips, while Zen 4C features up to 8 CCDs, with each CCX containing 8 cores, for a maximum of 128 cores.
In the Zen 5 architecture, AMD will stack up to 16 CCDs, while in the Zen 5C architecture, 12 CCDs will be stacked. Zen 5C chips will adopt a single CCX design with a total of 16 cores, potentially reaching up to 192 cores.
According to previous reports, the Zen 6 architecture will be manufactured using a 2nm process, with an expected 10% increase in IPC performance, support for 16-channel memory, the addition of new technologies like AI/ML FP16 floating-point instructions, and the introduction of PCIe 6.0 for higher I/O bandwidth.
