According to reports from February 21st by 快科技 (Fast Technology), while AMD's next-generation Zen5 CPU architecture has yet to arrive, rumors about Zen6 have already surfaced multiple times. Now, it's mentioned that the integrated GPU, surprisingly, will be paired with the next-next-generation RDNA5.
It's been disclosed that AMD is concurrently developing both Zen5 and Zen6 architectures. For Zen5, the desktop version will continue to integrate RDNA2 GPU, while the mobile version will upgrade to RDNA3.5.
The server version of Zen6 is codenamed Morpehus (named after the Greek mythology dream god Morpheus), while the consumer version is codenamed "Medusa".
The latest word has it that the Medusa Zen6 will adopt the new 2.5D interconnect packaging technology, replacing the current traditional multi-die chiplet approach, thereby boosting transmission bandwidth and performance.
The Ryzen with Zen6 architecture will also integrate GPU cores from the RDNA5 architecture, which implies that the yet-to-be-revealed RDNA4 will be skipped.
As for why this is being done, it's still unclear. It could be that RDNA4 doesn't offer a significant improvement, or perhaps RDNA5 is progressing faster.
Interestingly, in a recent document from Microsoft about the Xbox console, Zen6 and Navi5 were mentioned - the latter being part of the RDNA5 family.
According to previous leaks, the Zen6 architecture is set to undergo a comprehensive upgrade. The manufacturing process will be upgraded to CCD 2nm and IOD 3nm. The CCD will be upgraded to a native 32-core configuration, with a further 10% increase in IPC performance. It will support 16-channel memory and incorporate AI/ML FP16 floating-point instructions, among other enhancements.
Theoretically, Zen6 EPYC could achieve a massive 256-core 512-thread configuration!
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